Seeed Studio XIAO ESP32

Seeed Studio XIAO ESP32C3

Seeed Studio XIAO ESP32C3 is an IoT mini development board based on the Espressif ESP32-C3 WiFi/Bluetooth dual-mode chip. ESP32-C3 is a 32-bit RISC-V CPU, which includes an FPU (Floating Point Unit) for 32-bit single-precision arithmetic with powerful computing power. It has excellent radio frequency performance, supporting IEEE 802.11 b/g/n WiFi, and Bluetooth 5 (LE) protocols. This board comes included with an external antenna to increase the signal strength for your wireless applications. It also has a small and exquisite form-factor combined with a single-sided surface-mountable design. It is equipped with rich interfaces and has 11 digital I/O that can be used as PWM pins and 3 analog I/O that can be used as ADC pins. It supports four serial interfaces such as UART, I2C and SPI. There is also a small reset button and a bootloader mode button on the board. XIAO ESP32C3 is fully compatible with the Grove Shield for Seeeduino XIAO and Seeeduino XIAO Expansion board except for the Seeeduino XIAO Expansion board, the SWD spring contacts on the board will not be compatible.

With regard to the features highlighted above, XIAO ESP32C3 is positioned as a high-performance, low-power, cost-effective IoT mini development board, suitable for low-power IoT applications and wireless wearable applications.

Seeed Studio XIAO ESP32C6

Seeed Studio XIAO ESP32C6 is powered by the highly-integrated ESP32-C6 SoC, built on two 32-bit RISC-V processors, with a high-performance (HP) processor with running up to 160 MHz, and a low-power (LP) 32-bit RISC-V processor, which can be clocked up to 20 MHz. There are 512KB SRAM and 4 MB Flash on the chip, allowing for more programming space, and binging more possibilities to the IoT control scenarios.

XIAO ESP32C6 is Matter native thanks to its enhanced wireless connectivity. The wireless stack supports 2.4 GHz WiFi 6, Bluetooth® 5.3, Zigbee, and Thread (802.15.4). As the first XIAO member compatible with Thread, it's a perfect fit for building Matter-compliant projects, thus achieving interoperability in smart-home.